Acoustic Microscopes are used in many areas (semiconductor,
metals, ceramics, rubber and plastics) to discover internal
defects with non-destructive methods. Here are a few examples
of usage:
Semiconductor Applications
Delaminated area in a ball grid array
Investigation of an IC: Die top area
Phase detection of delaminated areas inside an integrated
circuit device
(red indicate 90% delaminations, yellow indicate 10% delaminations).
Coated wafer: Improper bonding between the coating material
and the wafer surface.
Investigation
of interior of an IC: Lead frame area.
Improper wafer bonding, the C-scan image is showing the interface
area between 2 anodic bonded wafers.
3-D reconstruction
of an IC package structure
High resolution example of the interior of an integrated
circuit
Voids and adhesion effects inside a capsule device.
Delaminations in the lead frame area of an IC
Defects in a super conductor
with copper cladding
Delamination of a flip structure.
Acoustic image of an optical
grid showing 0.2 µm lateral resolution (taken at 2GHz)
Material Science Applications
High-frequency grain boundary structure investigations of
steel, image width is 312 µm.
Voids and inclusions in rubber material
Microscopic cracks in steel during tensile testing
Microscopic cracks in a ball bearing
Thermal cracks in the interface area TiN/metal substrate
Inspection defects and boundaries
in plastic components
Life Science Applications
Acoustic imaging of enamel and dentine in a human tooth
